0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting

Product Details
Customization: Available
Application: Stone, Glass,Ceramic etc
Type: Electroplating
Manufacturer/Factory & Trading Company

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  • 0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting
  • 0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting
  • 0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting
  • 0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting
  • 0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting
  • 0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting
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Overview

Basic Info.

Model NO.
ZL-DX
MOQ
1 Roll
Custom
Accept
Usage
Wet & Dry Working
Grit
200#
Total Lengh
65 Meter/Roll
Transport Package
White Box+Carton
Specification
0.3mm 0.4mm 0.45mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm a
Trademark
ZLION
Origin
Xiamen, China
HS Code
82029910
Production Capacity
10000 Roll/Month

Product Description

65m/Roll High Quality Precision Diamond Wire Saw For Gemstone
Product Name:
Precision Diamond Wire Saw For Gemstone
Total Length (meter):
65m/roll
Diameter:
0.3mm 0.4mm 0.45mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm available
Packing:
Standard Carton Box
Delivery time:
3-10 working days
Payment way:
T/T, Western Union, Paypal
Mark:
Patented product. Used for cutting of hard material such as and stone, saphire, jade, silicon slice, etc.
Features:
- Made of high quality diamond and steel
- It is electroplated, provide sharper cutting and durable
- Smaller cutting seam, low waste and more yield
- Design for high-precision cutting granite, marble, concrete, stone, jade, glass, metal, plastic, etc.
- Used for manual, single-line, multi-line diamond cutting machine
Advantage:
1.Durable, Strong tensile strength
2.Small diameter, small cutting seam
3.Can be made as long as 200 meters
Detailed Photos

0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting

Company Profile

0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting

FAQ

0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting

 
 

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